Wiresawing is a method for slicing and cutting silicon wafers, granite, marble and stone. In wiresawing,
a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece
and the wire. Wiresawing is commonly used in the granite and stone cutting industry, silicon wafer production, and other crystal
cutting applications. Wiresawing is particularly effective for semiconductor materials because it cuts crystals with a high
yield and small kerf loss.