HomeAbout UsServicesWhat we doCore DrillingWall SawingSlab SawingWire SawingHand SawingLinksContact Us
Wiresawing is a method for slicing and cutting silicon wafers, granite, marble and stone. In wiresawing, a taut steel wire is run through an abrasive slurry of silicon carbide which acts as the cutting agent between the work piece and the wire. Wiresawing is commonly used in the granite and stone cutting industry, silicon wafer production, and other crystal cutting applications. Wiresawing is particularly effective for semiconductor materials because it cuts crystals with a high yield and small kerf loss.